Resistor & Smd & inductor

CD54 150uH (151) SMD Power Inductor

12.98
A CD54 150uH Surface Mount Power Inductor (150 microH) is a 2-terminal passive device having a coil of wire wound wrapped around a core. A core may be magnetic metal or air to produce a high inductance in the wire. The terminals are pads on a surface mounting.

CD54 15uH (150) SMD Power Inductor

11.80
A CD54 15uH Surface Mount Power Inductor (15 microH) is a 2-terminal passive device having a coil of wire wound wrapped around a core. A core may be magnetic metal or air to produce a high inductance in the wire. The terminals are pads for surface mounting.

CD54 1uH (1R0) SMD Power Inductor

12.98
A CD54 1uH Surface Mount Power Inductor (1 microH) is a 2-terminal passive device having a coil of wire wound wrapped around a core (which may be magnetic metal or air) to produce a high inductance in the wire. The terminals are pads for surface mounting.

CD54 2.2uH (2R2) SMD Power Inductor

12.98
A CD54 2.2uH Surface Mount Power Inductor (2.2 microH) is a 2-terminal passive device having a coil of wire wound wrapped around a core. A core may be magnetic metal or air to produce a high inductance in the wire. The terminals may be pads on a surface mounting.

FDN304P MOSFET – (SMD SOT-23 Package) – 20V 2.4A P-Channel MOSFET

16.52
This P-Channel 1.8V specified MOSFET uses advanced low voltage Power Trench process. It has been optimized for battery power management applications.

FDN306P MOSFET – (SMD SOT-23 Package) – 12V 2.6A P-Channel MOSFET

16.52
This P-Channel 2.6V specified MOSFET uses advanced low voltage Power Trench process. It has been optimised for battery power management applications.

FDN337N MOSFET – (SMD SOT-23 Package) – 30V 2.2A N-Channel Logic Level Enhancement Mode MOSFET

16.52
Super SOT-23 N-Channel logic level enhancement mode power field effect transistors are produced using high cell density. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package.

FDN338P MOSFET – (SMD SOT-23 Package) – 20V 1.6A P-Channel MOSFET

16.52
This P-Channel 2.5V specified MOSFET uses advanced low voltage Power Trench process. It has been optimized for battery power management applications.

FDN339N MOSFET – (SMD SOT-23 Package) – 20V 3A N-Channel MOSFET

16.52
This N-Channel 2.5V specified MOSFET is produced advanced Power Trench process that has been especially tailored to minimize theon-state resistance and yet maintain low gate charge for superior switching performance.

FDN340P MOSFET – (SMD SOT-23 Package) – 20V 2A P-Channel Logic Level MOSFET

16.52
This P-Channel Logic Level MOSFET is produced uses advanced low voltage Power Trench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance. These devices are well suited for portable electronics applications: load switching and power management, battery charging circuits, and dc-dc conversion.

FDN357P MOSFET – (SMD SOT-23 Package) – 30V 1.9A P-Channel Logic Level Enhancement Mode MOSFET

16.52
Super SOT-23 P-Channel logic level enhancement mode power field effect transistors are produced using high cell density. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package.

FDN358P MOSFET – (SMD SOT-23 Package) – 30V 1.5A P-Channel Logic Level Enhancement Mode MOSFET

16.52
Super SOT-23 P-Channel logic level enhancement mode power field effect transistors are produced using high cell density. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package.