400 Points Half Size Solderless Breadboard

400 Points Half Size Solderless Breadboard is a high-quality breadboard with power lanes and printed top face for easy prototyping.

A breadboard is used to make up temporary circuits for testing or to try out an idea. No soldering is required so it is easy to change connections and replace components.

SKU: RW-00345

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50.00

Inclusive of GST

50 in stock

50 in stock

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  • Warranty 1 year
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Description

400 Points Half Size Solderless Breadboard is a high-quality breadboard with power lanes and printed top face for easy prototyping.

A breadboard is used to make up temporary circuits for testing or to try out an idea. No soldering is required so it is easy to change connections and replace components.

It is Reusable for fast build a prototype of an electronic circuit – will accept transistors, diodes, LEDs, resistors, capacitors and virtually all types of components – No soldering required – Can modify or revise the circuits easily Fit for jumper wire of 0.8mm diameter – Standard 2.54mm hole spacing Adhesive sheet on the backside of the board – Multiple breadboards can be spliced together too.

Specifications and features:

 

  • 400 tie points
  • 1 Double strip, Total 300 tie points
  • 2 Power lanes, Total 100 tie points in power lanes
  • Perfect for Arduino shield prototyping and testing
  • Plastic housing, metal contact clips

 

Package Includes:

1 x 400 Points Half Size Solderless Breadboard

* Product Images are shown for illustrative purposes only and may differ from actual product.

Additional information

Operating voltage

2.5 3.0V

Pixel Resolution

0.3MP

Photosensitive array

640 x 480

Optical Size

1.6 inch

Angel of view

67 degrees

Maximum Frame Rate

30fps VGA

Sensitivity

1.3V/(Lux-sec)

Dormancy

Less than 20A

Power consumption

60mW/15fpsVGA YUV

Temperature operation Range

-30 C ~ 70 C

Pixel area

3.6 x 3.6 m

Signal to noise ratio (SNR)

46 dB

Dynamic range

52 dB

Specification

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